IMI is currently looking for Mechanical Design Simulation Engineer Applicants, for immediate hiring.
Please send applications to the HR Manager: patrick.cosico@global-imi.com, copy to hiring manager: cherie.sasan@global-imi.com
Position: Mechanical Design Simulation Engineer
Focus of research is the thermomechanical and thermoelectrical finite element simulation of
new automotive and industrial semiconductor technologies in discretes and power module
packaging as well as the corresponding material and interface characterization with a focus
on degradation effects. The aim is to reach best in class design, performance, cost and quality.
Job Description:
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Perform thermal/structural calculations using proprietary in-house software and
external programs such as Solidworks, ANSYS Autodesk, Ansys Mechanical,
Autodesk Mechanical Simulation, CFD, and Flotherm.
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Develop and implement advanced simulation techniques including new models
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Support New Package Development by performing stress analysis of package
designs under different thermomechanical loading conditions
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Support material (metals, dielectrics) characterization and degradation analysis by
simulation
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Participate in definition and development of new technologies by integrating
simulation into the research & development process
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Develop design guidelines (thermal, mechanical) for high quality automotive and
industrial products based on knowledge about mechanical and electrical behavior and
limitations
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Act as a problem solver by finding physics-based explanations of your customers’
problems and suggesting appropriate countermeasures
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Recommend and suggest design improvements to enhance the package robustness
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Support the development of leading edge simulation approaches & advanced material
modelling
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Evaluate results, coordinates with Design and Development’s mechanical designers,
material specialist and electrical simulation engineers and logically apply them to real-
world designs to improve upon and/or define workable engineering rules and
procedures
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Provide technical support and advice to internal colleagues as required
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Represent the company in a professional manner in technical meetings with
customers, on site or in teleconferences, conducting presentations where required
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Prepare technical reports as and when required
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Any other similar/reasonable requirements as requested
Qualifications:
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A Mechanical Engineering or Physics Degree
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A minimum of three to five years of work experience in the field of electro-thermal
FEM simulations, ideally in modeling and simulation of semiconductor package
systems
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Experience of design engineering including thermal analysis and structural
calculations.
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Knowledge on semiconductor technologies and semiconductor physics, assembly
and interconnect technologies desired.