
Richard Raymond Dimagiba
Associate Professor
Department of Mechanical Engineering, University of the Philippines Diliman
dimagiba@upd.edu.ph
Education:
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BS in Mechanical Engineering, University of the Philippines Diliman, 1994
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PhD in Mechanical Engineering, University of Sheffield, U.K., 2000
Research Interests
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Finite Element Analysis
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Fracture Mechanics
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Thermo-mechanical Analysis
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Semiconductor Package Design
Publications
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YH Lee, D Chowdhury, RR Dimagiba and R Ciccariello, ‘Effect of ESD Layout on the Assembly Yield and Reliability’, International Electron Device Meeting, 2006.
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RR Dimagiba, S Ganapathysubramanian and M Modi, ‘A review of first-level interconnect modeling methodology’, 31st International Electronics Manufacturing Technology Symposium (IEMT), 2006.
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P Raghavan, S Ganapathysubramanian, RR Dimagiba, J Felde and C Kumar, ‘Solder joint reliability modeling of low density interconnect ball grid array packages’, Intel Assembly and Test Technology Journal, 2006.
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S Ganapathysubramanian, RR Dimagiba, B Chandran and S Sane, ‘Exploring the possibility of approximating viscoelastic response of underfill materials through the use of appropriate linear-elastic material models’, ASME InterPACK 2005.
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RR Dimagiba, 'Quasi-Static Drop Modeling for CSP Board Level Reliability Assessment’, Intel Philippines Technology Symposium, 2004.
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RR Dimagiba, 'The Development of the Boundary Element Method for Three-dimensional Elastoplastic Analysis', Proceedings of the European Boundary Element Symposium, Southampton, U.K., pp. 93-102, 1998.